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STM offers a wide
variety of semiconductor wafer tapes to
suit our customer needs. Our UV and non UV tapes are available in a range
of adhesive thicknesses, glue types and tack values. Whether
you are seeking a new semiconductor tape and materials vendor for an existing process, interested
in qualifying a second source, or are embarking on a new grinding and dicing project
altogether, STM will work with you throughout the qualification
process to ensure the best results possible. We carry a whole
suite of grinding and dicing tape
solutions in the forms of both UV tape and Non UV
tape,
as well as a high quality detaping tape that
is quickly becoming an industry standard. A few characteristics
of STM tape products include:
- Near-zero
adhesive residue
- Acid resistant for Si etch process
- Wafer thickness accuracy(TTV) after backgrinding
- Variety of low to high tack values to choose from
- Various thicknesses for better absorption of high ink dots and bumps
All STM UV and non UV tapes are ISO certified and are
tested against strict specifications for the Semiconductor industry. STM also
offers a line of antistatic tapes. For specific applications,
please contact one of our sales representatives.
What’s the difference between UV Tape and Non-UV Tape?
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